Description / Abstract:
IPC-D-326, Revision A, January 2004 - Information Requirements for Manufacturing Printed Boards and Other Electronic Assemblies
This document covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, and delivery and/or distribution of electronic assemblies.
Purpose
The purpose of this document is to outline an effective method of transferring product assembly information intercompany or from OEM to the assembler.
Classification
The level of assembly documentation that is required is dependent on both the overall complexity of the product and whether the assembly process must meet government, military or other regulatory agency requirements.
This document covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, and delivery and/or distribution of electronic assemblies.
Purpose
The purpose of this document is to outline an effective method of transferring product assembly information intercompany or from OEM to the assembler.
Classification
The level of assembly documentation that is required is dependent on both the overall complexity of the product and whether the assembly process must meet government, military or other regulatory agency requirements.
