BS EN 61190-1-2:2007

Cross References:
IEC 60194
IEC 61189-5
IEC 61189-6
IEC 61190-1-1
IEC 61190-1-3
IEC 61191-1
IEC 61191-2
IEC 61191-3
IEC 61191-4
ISO 9000
ISO 9001
ISO 9453
ISO 9454-2
ISO 10012-1
EN 60194:2006
EN 61189-5:2006
EN 61189-6:2006
EN 61190-1-1 2002
EN 61190-1-3:2007
EN 61191-1:1998
EN 61191-2:1998
EN 61191-3:1998
EN 61191-4:1998
EN ISO 9000:2005
EN ISO 9001:2000
EN ISO 9453:2006
EN ISO 9454-2:2000
EN 30012-1:1993




Keywords: Electronic equipment and components; Electronic engineering; Electrical connections; Bonding; Soldering; Soldered connectors; Solders; Pastes; Quality control; Quality assurance; Classification systems

Product Code(s): 30133285,30133285

This product references:ISO 9000 - Quality management systems - Fundamentals and vocabulary
BS EN 60194:2006 - Printed board design, manufacture and assembly. Terms and definitions
BS EN 61190-1-3:2007 - Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
BS EN ISO 9453:2006 - Soft solder alloys. Chemical compositions and forms
BS EN ISO 9000:2005 - Quality management systems. Fundamentals and vocabulary
BS EN 61189-5:2006 - Test methods for electrical materials, interconnection structures and assemblies. Test methods for printed board assemblies
BS EN 61190-1-1:2002 - Attachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly
BS EN 61189-6:2006 - Test methods for electrical materials, interconnection structures and assemblies. Test methods for materials used in manufacturing electronic assemblies
BS EN ISO 9001:2000 - Quality management systems. Requirements
This product referenced by:BS EN 61189-3:2008 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 61190-1-3:2007 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 61192-5:2007 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 62137-1-1:2007 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 62137-1-2:2007 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 62137-1-3:2009 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 62137-1-4:2009 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 62137-1-5:2009 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 61190-1-3:2007 A1:2010 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
BS EN 60749-21:2011 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
This product replaces:BS EN 61190-1-2:2002 - Attachment materials for electronic assembly. Requirements for solder pastes for high-quality interconnections in electronic assembly