TechAmerica/ANSI GEIA-STD-0006

This standard defines the requirements for fully replacing undesirable surface finishes usingsolder dip. Requirements for qualifying and testing the refinished piece parts are also included.This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPbfinishes. This dipping is different from dipping to within some distance of the body for thepurposes of solderability; solder dipping for purposes other than full replacement of pure tin andother Pb-free tin alloy finishes are beyond the scope of this document. It covers process andtesting requirements for robotic and semi-automatic dipping process but does not cover purelymanual dipping processes, due to the lack of understanding of the appropriate requirements forhand-dipping for tin whisker mitigation at this time.

This standard does not apply to piece-part manufacturers who build piece parts with a hot solderdip finish. It applies to refinishing performed by any other group, including a third partysupplier, production facilities at the supplier and other organizations, whenever the intent of thedipping is to have full coverage and replacement of Pb-free tin.

The intent of this standard is for suppliers and users to incorporate these requirements into theiroperations to provide a consistent and well-controlled process for product applications thatrequire significant control, typically Control Levels 2C or 3 of GEIA-STD-0005-2. Each usershall determine the applicability of this standard and the need for full replacement of the existingtermination finish. This standard does not guarantee a particular yield or reliability of pieceparts going through solder dipping. Some applications may have unique requirements thatexceed the scope of this standard, and should be specified separately.Pb-free tin piece parts which have been dipped in compliance with this standard are no longerconsidered to be Pb-free tin finished for the purposes of GEIA-STD-0005-2.

People Who Bought This Also Bought:
TechAmerica/ANSI GEIA-STD-0005-3- Performance Testing for Aerospace and High Performance Electronic Interconnects Containing PB-free Solder and FinishesTechAmerica/ANSI GEIA-STD-0005-2- Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic SystemsTechAmerica GEIA-HB-0005-2- Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder and FinishesTechAmerica GEIA-HB-0005-3- Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic SystemsTechAmerica/ANSI GEIA-STD-0005-1- Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free SolderTechAmerica GEIA-HB-0005-1- Program Management / Systems Engineering Guidelines for Managing the Transition to Lead-Free ElectronicsISO 9001:2008- Quality management systems -- RequirementsIEC 60947-5-6 Ed. 1.0 b:1999- Low-voltage switchgear and controlgear - Part 5-6: Control circuit devices and switching elements - DC interface for proximity sensors and switching amplifiers (NAMUR)