ANSI/IPC J-STD-002C

This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes. This standard is intended for use by both vendors and users.



Keywords: ECA J-STD-002B

This product referenced by:ANSI/IPC A-610D - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)
This product replaces:ANSI/IPC J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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ANSI/IPC J-STD-002C
ANSI/IPC J-STD-002B

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